Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance

Authors

  • Jirapol Klinbun
  • Pradit Terdtoon

DOI:

https://doi.org/10.4186/ej.2017.21.1.255 Full article

Abstract

A new way to remove the intense heat by developing and implementing an innovative low cost compact loop thermosyphon has been widely observed. Especially, it was concluded that nano-fluids are potential heat transfer fluids to be used as working fluid in thermosyphon. Therefore, the thermophysical or transport properties of nano-fluids in thermosyphon need to be discussed. In present work was to experimental study the thermal performance of thermosyphon using a copper nano-fluid as a working fluid. The experiment was performed in order to measure the temperature distribution and compare heat transfer rate of the thermosymphon with nano-fluid and with pure water. The concentration of copper nano-particle was 10, 30 and 50 ppm. The tested working temperature was 60, 70 and 80°C. Results shown that the concentration of 50 ppm of copper nano-fluid improved thermal performance compared with the case of pure water. The optimum and behavior of copper nano-fluid in thermosyphon is presented, which highlights all of the beforehand mentioned advantages.

Keywords:

Nano-fluid, thermosyphon, thermal performance, thermal resistance.

Affiliations

  • Jirapol Klinbun Rajamangala University of Technology Rattanakosin
  • Pradit Terdtoon Chiang Mai University

Corresponding author: Jirapol Klinbun, jirapol.kli@rmutr.ac.th

1613 1722

Author Biographies

  • Jirapol Klinbun

    Department of Mechanical Engineering, Faculty of Engineering, Rajamangala University of Technology Rattanakosin, 96 Moo 3, Phutthamonthon Sai 5 Road, Salaya, Phutthamonthon, Nakorn Prathom 73170, Thailand

  • Pradit Terdtoon

    Department of Mechanical Engineering, Faculty of Engineering, Chiang Mai University, 239 Huay Kaew Road, Muang District, Chiang Mai 50200, Thailand

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How to Cite

[1]
J. Klinbun and P. Terdtoon, “Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance”, Eng. J., vol. 21, no. 1, pp. 255–264, Jan. 2017, doi: 10.4186/ej.2017.21.1.255.

Citations

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Published

2017-01-31

Issue

Vol. 21 No. 1 (2017): Regular Issue

Section

Modern Engineering Technology

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